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                                     (ÀÚ¼¼ÇÑ ±â¼ú »ç¾çÀº ¾Æ·¡ ǰ¸ñ Ŭ¸¯ ÇÏ½Ã¸é µË´Ï´Ù.)             

1. TRIBOLOGY (¸¶Âû¸¶¸ðÀ±È°½ÃÇèºÐ¼®±â, Polishing Machine)

1-1. °¡È¤ÇÑ È¯°æ°ú ´Ù¾çÇÑ ÇüÅÂÀÇ ¸¶Âû¸¶¸ðÀ±È°½ÃÇèºÐ¼®±â±â

1-2. Micro/Nano Tribology

1-3. ³»¸¶¸ðÀü¿ë½ÃÇè±â(Abrasion Tester)

 

1-4. Grinding,Lapping, Polishing machine

 

 

2. ¹°¼º ¹× °è¸é½ÃÇèºÐ¼®±â±â(Nano Hardness/Scratch/ÀÜ·ùÀÀ·ÂÃøÁ¤±â)

2-1. Nano Hardness Tester ¹× Ãʹ̼Ұ浵±â

2-2. Scratch Tester(ÄÚÆÃÁ¢Âø·Â/½ºÅ©·¹Ä¡ ½ÃÇè)

2-3. Ã˰¢,°¨¼º°øÇÐÀû Ç¥¸éÀçÁúÀÇ /¹°¼ºº¯È­/Ç¥¸éÇü»ó°ÅÄ¥±âµî

        ¸¶ÂûƯ¼º/µîÀ» ÃÑüÀû Æò°¡ÇÏ´Â ¸¸´É½ÃÇè±â

 

   

2-4. °æµµ±â

2-5. Pull Off ŸÀÔ Á¢Âø·Â ½ÃÇè±â

2-6. Àú~Á߿뷮 ±â°è½Ä ÀÎÀå¾ÐÃà ½ÃÇè±â

2-7. ÀÜ·ùÀÀ·ÂÃøÁ¤±â,XRD

 

3. 3Â÷¿ø Ç¥¸éÇü»ó & Roughness ÃøÁ¤±â(Topography)

3-1. ´Ù¾çÇÑ 3Â÷¿ø Ç¥¸é ¹× ¹× Çü»ó ÃøÁ¤±â(Nano Meter/Micron´ÜÀ§)

3-2. ¼öÁ÷ Angstrom,Nano,Micro´ÜÀ§ ºÐÇØ´É ÃøÁ¤À» ÇÑÃøÁ¤±â¿¡!

3-3. ¾ËÆÄ½ºÅÜ(¹Ú¸·ÀÇ µÎ²²ÃøÁ¤±â,¼öÁ÷ nano ºÐÇØ´É)

3-4. Á¢ÃË½Ä + ¿Éƽ¼¾¼­¸¦ ÇÑ´ëÀÇ ÃøÁ¤±â¿¡¼­ ±¸ÇöÇÑ Ãֽбâ¼ú

3-5. »ý»ê¶óÀΠ °í¼ÓÀû¿ë 3Â÷¿ø ÃøÁ¤±â

3-6. ¸¶ÀÌÅ©·Î´ÜÀ§ PCB¸ðµâµîÀÇ ´ÜÀ§ °¡°ø¼º Ç¥¸é°Ë»ç ºÐ¼®±â                            --->Nikon»çÀÇ ¸ðµ¨ Nexiv

3-7.AFM(¿øÀÚÇö¹Ì°æ) + Raman Spectrometer(ÀÛ¾÷Áß) 3.8 ÈÞ´ë¿ë 3Â÷¿ø ÃøÁ¤±â(ÀÛ¾÷Áß)
   
3-9. ÄÚÆÃµÎ²²ÃøÁ¤(IN-SITU ¹Ú¸·ÁõÂø°øÁ¤Á¦¾î),  Ellipsometer

3-10. Æòźµµ,ºñƲ¸²,  Stress ÃøÁ¤±â

3-11.Roughness Meter(ÈÞ´ë¿ë Ç¥¸é°ÅÄ¥±âÃøÁ¤)

 

3-12. ¿þÀÌÆÛ Àü¿ë ¹× ¼ÒÀç µÎ²²ÃøÁ¤±â(TTV,µÎ²²)

3-13. ¿£Áø½Ç¸°´õ/ÇǽºÅæ/±â°èºÎǰ °Ë»ç¹× ÃøÁ¤±â--->ÀÛ¾÷Áß

 

4. 2Â÷¿ø Ç¥¸éÇü»ó ÃøÁ¤±â(ÀüÀÚÇö¹Ì°æ) & ¹Ú¸·ÄÚÆÃµÎ²² ÃøÁ¤±â

4-1.Ź»ó¿ë ÀüÀÚÇö¹Ì°æ(Mini SEM, 10~20,0000¹è)

4-2. Çö¹Ì°æ

4-3. MBE,CVD,ÄÚÆÃÁõÂø±â±â ¹× Simulator (ÀÛ¾÷Áß...)

 

 

5. ÀÚµ¿Â÷/¿£Áø °ü·Ã ½ÃÇè±â/LASER°¡°ø

5-1. ÀÚµ¿Â÷ °ü·Ã ½ÃÇè±â

5-2. ¿£Áø´ÙÀ̳ª¸ð¸ÞÅÍ

5-3.Tractor Axle Dynamometer/Brake Dynamometer 5-4. Laser Cutting,Welding,Gluing Head

5-5. ºñÆÄ±«½Ä ¿£Áø½Ç¸°´õ/ÇǽºÅæ/±â°èºÎǰ °Ë»ç¹× ÃøÁ¤±â

5-6. Ball End Mill(º¼¿£µå¹Ð)

 

6. ÀüÀÚ/¹ÝµµÃ¼/LCD/ÄÚÆÃ °ü·Ã½ÃÇèºÐ¼®±â

6-1. CMP Tester

6-2. Pad Probe(CMP°øÁ¤ EPD Device)

6-3. Hard Disk CSS Tester

 

   

6-4. ¾ËÆÄ½ºÅÜ(¹Ú¸·ÀÇ µÎ²²ÃøÁ¤±â,¼öÁ÷ nano ºÐÇØ´É)

6-5. Á¢ÃË½Ä + ¿Éƽ¼¾¼­¸¦ ÇÑ´ëÀÇ ÃøÁ¤±â¿¡¼­ ±¸ÇöÇÑ Ãֽбâ¼ú

6-6.¼öÁ÷ Angstrom,Nano,Micro´ÜÀ§ ºÐÇØ´É ÃøÁ¤À» ÇÑÃøÁ¤±â¿¡

 

6-7. ÄÚÆÃµÎ²²ÃøÁ¤(IN-SITU ¹Ú¸·ÁõÂø°øÁ¤Á¦¾î),  Ellipsometer

6-8. Æòźµµ¿Í  Stress ÃøÁ¤±â

   

6-9. ¿þÀÌÆÛ Àü¿ë ¹× ¼ÒÀç µÎ²²ÃøÁ¤±â(TTV,µÎ²²)

6-10. MBE,CVD,ÄÚÆÃÁõÂø±â±â ¹× Simulator--->ÀÛ¾÷Áß...

6-11.Á¢Âø·Â ½ÃÇè±â

 

 

7. ¿ÀÀÏ/À±È°À¯/À¯¾ÐÀ¯ ºÐ¼®±â ¹× ¿¹¹æº¸Àü 

7-1. Ferrogrpahy(¸¶¸ðÀÔÀڽð¢È­ºÐ¼®)

7-2. Á¡µµ°è ¹× ´Ù¾çÇÑ ÃøÁ¤±â

7-3. Lubricants/Grease(Ư¼ö À±È°À¯/±×¸®À̽ºÀ¯)

 

 

8. ÈÞ´ë¿ë °èÃø±â

8.1 ÈÞ´ë¿ë °æµµ±â/Çö¹Ì°æ/¸¶Âû°è¼öÃøÁ¤±â/Roughness/ÄÚÆÃµÎ²¾ÃøÁ¤±â/¹Ù´ÚÀç ¹Ì²ô·³ÃøÁ¤±â

8.2 ÀüÀÚ Àú¿ï(Balance)

 

9. ¾ÈÀü°ü¸® Àåºñ

 

9-1. ¹Ù´ÚÀç ¹Ì²ô·³ ÃøÁ¤±â(ASTM/¹Ì±¹¾ÈÀüÀ§»ý°ü¸®±Ô°Ýµî)

9-2. ÁøÀÚŸÀÔ µµ·Î/Floor/°¢Á¾¹Ù´Ú¸é ¸¶Âû°è¼ö ÃøÁ¤±â

9-3. ¿îÀüÀÚ/ÀÛ¾÷ÀÚÀÇ Á¹À½°æº¸ ¹× ÃøÁ¤±â

 

 

9. °ø°ú´ëÇб³ ±³À°¿ë Àåºñ

 

10-1. Á¦¾îÁøµ¿ ½ÇÇè±â

10-2. °øÁ¤Á¦¾î ¸ðÀÇ ½ÇÇè ¼ÒÇÁÆ®¿þ¾î

10-3. °ø°ú´ëÇÐ ±âÃÊ ½ÇÇèÀåºñ

 

       

 
 
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